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Stackup ======= The PCB is designed to be produced with 4 layers using the JLCPCB (https://jlcpcb.com/) JLC2313 stackup. (0.1mm prepreg (eps_r = 4.05) between the outer and inner layer.) Using the JLCPCB impedance calculator, the following trace parameters were obtained: 100Ω differential: 4.00mil (102µm) trace width / 5.00mil (127µm) space 50Ω single-ended: 5.78mil (147µm) trace width Ground spacing: 200µm Vias ==== JLC multilayer: min. via drill: 0.2mm, min. via diameter: 0.45 mm
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Adapter to connect AMS CMV2000 image sensor to FMC
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