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[PCB] adjust rendered finish
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H3wastooshort committed Jul 3, 2024
1 parent 46ba08c commit adfb7f3
Showing 1 changed file with 3 additions and 3 deletions.
6 changes: 3 additions & 3 deletions hardware/BikeUSBv2.kicad_pcb
Original file line number Diff line number Diff line change
Expand Up @@ -41,14 +41,14 @@
(stackup
(layer "F.SilkS" (type "Top Silk Screen") (color "White"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
(layer "F.Mask" (type "Top Solder Mask") (color "Purple") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (color "FR4 natural") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Purple") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
(copper_finish "None")
(copper_finish "HAL lead-free")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
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